Polyteknik AS has build up an extensive knowledge of the sputtering process from both in-house coating projects and R&D projects and manufactured systems. We support our customers in the range from small-scale advanced R&D process development projects to full scale production systems. Polyteknik has experience with a wide range of sputtering processes including; DC and RF sputtering, HiPIMS, Pulsed or Bipolar Reactive sputtering processes.
Sputtering is the primary alternative to evaporation for metal deposition in e.g. microelectronic fabrication. The technique has a more advanced step coverage and is much more capable at producing layers of compound materials and alloys. In sputtering applications high energy ions in a plasma of inert gas which strikes a target containing the material to be deposited. Because of the momentum exchange between the ions and the atoms in the target, material is ejected from the target. The amount of ejected material from each ion collision depends on the target material, yielding a highly material specific deposition rate. During deposition of elemental metals, simple DC sputtering is usually favored. During deposition of insulating materials an RF plasma must be used.
Electron Beam Evaporation
Polyteknik has previously delivered various sized E-Beam deposition systems for both high-end industry and R&D projects. With the combination of a highly comprehensive process, capable software, and highly skilled mechanical engineers, Polyteknik can secure the most optimum with our services. High uniformity and difficult materials are easily controlled with our newest Cryosoft3 software.
Electron Beam Evaporation is a process similar to thermal evaporation where a source material is heated above sublimation temperature and evaporated to form a film on surfaces exposed by the evaporated atoms. A noticeable advantage of E-Beam Evaporation, when compared to thermal evaporation, is the possibility to add a larger amount of energy into the source material yielding a higher density film with an increased adhesion to the substrate.
As an innovative technology based company, Polyteknik has gained substantial experience in customer-specific R&D project – ensuring a strong focus on the continuous development. Polyteknik has participated in research and innovation projects with universities and technical institutes to esnure updated knowledge within state-of-the-art technology and process advances. Experience and highly skilled personnel can ensure that the outcome is anchored in the company to benefit existing and future customer project.